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Epoxy resin adhesive system | HP-E5K
Epoxy system HP-E5K is an unfilled, medium viscosity 2-component combination of resin and hardener with a processing time of 5 min. It is cold curing and can be used for the following application:
✔ adhesive resin
...bonding metal, wood, rubber, ceramics, rigid foams and many plastics
...creation of high performance bondings
...very good wetting of the substrate surface
...can be used as a rapid adhesive without additives
...resistant to oils, greases, moisture, diluted acids/alkalis, many solvents
Hint:
The adhesive resin system HP-E5K is free of nonylphenol and does not contain benzyl alcohol or other reactive thinners.
Since epoxy resin adhesives do not release any volatile components during curing, no pressure is required on the bond in comparison to solvent-based adhesives or white glues. Heavy pressing, must be avoided at all costs, as a minimum amount of adhesive is required between the substrate surfaces for optimum formation of the internal tensile strength of the adhesive joint.
Technical data | HP-E5K
✔ processing time: 5 min
✔ colour: Light yellow / clear
✔ mixing ratio (weight): 100 parts resin / 100 parts hardener
✔ mixing viscosity: medium viscosity
✔ processing temperature (minimum): 5°C
Warning
H315 Causes skin irritation.
H317 May cause an allergic skin reaction.
H319 Causes serious eye irritation.
H411 Toxic to aquatic life with long lasting effects.
Hardener component:
Danger
H314 Causes severe skin burns and eye damage.
H317 May cause an allergic skin reaction.
H412 Harmful to aquatic life with long lasting effects.
