Epoxy resin adhesive system | HP-E5K

Epoxy resin adhesive system | HP-E5K

✔ adhesive resin
...bonding metal, wood, rubber, ceramics, rigid foams and many plastics
...creation of high performance bondings
...very good wetting of the substrate surface
...can be used as a rapid adhesive without additives
...resistant to oils, greases, moisture, diluted acids/alkalis, many solvents

Hint:
The adhesive resin system HP-E5K is free of nonylphenol and does not contain benzyl alcohol or other reactive thinners.

Since epoxy resin adhesives do not release any volatile components during curing, no pressure is required on the bond in comparison to solvent-based adhesives or white glues. Heavy pressing, must be avoided at all costs, as a minimum amount of adhesive is required between the substrate surfaces for optimum formation of the internal tensile strength of the adhesive joint.